芯片产品汇总表
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产品型号
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详细介绍
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标准
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内置电容
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存储容量
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用户可用
容量
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功能特点
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封装形式
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F8001Z
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产品说明下载
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ISO/IEC 14443A
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17pf
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1K Bytes
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752 Bytes
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4字节UID
通用逻辑加密卡芯片
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Wafer,COB,
Gold Bump
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F8001X
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产品说明下载
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ISO/IEC 14443A
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17pf
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1K Bytes
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752 Bytes
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7字节UID
通用逻辑加密卡芯片
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Wafer,COB,
Gold Bump
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F8004
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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96 Bytes
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48 Bytes
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通用NFC标签芯片
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Wafer,COB,
Gold Bump
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F8003
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产品说明下载
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ISO/IEC 14443A
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17pf
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4K Bytes
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3568 Bytes
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通用逻辑加密卡芯片
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Wafer,COB,
Gold Bump
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F8213
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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180 Bytes
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144 Bytes
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通用NFC标签芯片
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Wafer,COB,
Gold Bump,
SOT,QFN
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F8216CF
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf/130pf
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996 Bytes
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944 Bytes
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密钥暴力攻击失效次数
设置,两级防冲突,
3DES加密,带触发功能
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Wafer,COB,
Gold Bump,
SOT
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F8216F
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf/130pf
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924 Bytes
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888 Bytes
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通用NFC标签芯片
带触发功能
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Wafer,COB,
Gold Bump
SOT
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F8216
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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924 Bytes
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888 Bytes
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通用NFC标签芯片
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Wafer,COB,
Gold Bump
SOT
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F8215
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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540 Bytes
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504 Bytes
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通用NFC 标签芯
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Wafer,COB,
Gold Bump
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F8025
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产品说明下载
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NFC Type5;
ISO/IEC 15693
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23.5pf
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128 Bytes
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128 Bytes
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DSFID、AFI、EAS锁定
快速读卡
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Wafer,COB,
Gold Bump
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F8025SF
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产品说明下载
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NFC Type5;
ISO/IEC 15693
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23.50pf
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128 Bytes
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128 Bytes
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带外FUSE通断检测
CID定制
支持自毁
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Wafer,
Gold Bump
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F8018
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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192 Bytes
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144 Bytes
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通用NFC标签芯片
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Wafer,COB,
Gold Bump
SOT
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F8013
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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192 Bytes
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144 Bytes
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通用NFC标签芯片
带触发功能
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Wafer,COB,
Gold Bump
SOT
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F8019
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产品说明下载
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NFC Type5;
ISO/IEC 15693
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23.5pf
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256 Bytes
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256 Bytes
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双向、单向认证
SM7算法
专有定制算法
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Wafer,COB,
Gold Bump
SOT
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F8023
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产品说明下载
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I 2C
NFC Type5;
ISO/IEC 15693
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23.5pf
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180 Bytes
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144 Bytes
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双接口通信
可作Master
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QFN8
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F8022
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产品说明下载
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I 2C
NFC Type2;
ISO/IEC 14443A
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50pf
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2K Bytes
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1912 Bytes
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双接口通信
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QFN8
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F8216C
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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996 Bytes
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944 Bytes
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3DES认证算法，
密钥暴力攻击失效次数
设置
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Wafer,COB,
Gold Bump
SOT
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F8216SC
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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996 Bytes
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944 Bytes
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96位真随机数签名映射
128位密钥
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Wafer,COB,
Gold Bump
SOT
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F8213SC
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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192 Bytes
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144 Bytes
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定制加密算法，
密钥暴力攻击失效次数
设置
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Wafer,COB,
Gold Bump
SOT
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F8010
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产品说明下载
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NFC Type2;
ISO/IEC 14443A
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50pf
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192 Bytes
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144 Bytes
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3DES算法进行
三重认证
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Wafer,COB,
Gold Bump
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F8002-1024
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产品说明下载
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NFC Type5;
ISO/IEC 15693
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23.5pf
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208 Bytes
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128 Bytes
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用户数据块锁定,
DSFID、AFI、EAS
锁定
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Wafer,COB,
Gold Bump
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F8002-2048
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产品说明下载
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NFC Type5;
ISO/IEC 15693
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23.5pf
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336 Bytes
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256 Bytes
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用户数据块锁定,
DSFID、AFI、EAS
锁定
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Wafer,COB,
Gold Bump
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F8002P-2048
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产品说明下载
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NFC Type5;
ISO/IEC 15693
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23.5pf
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336 Bytes
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256 Bytes
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32位密钥保护,
32位写密钥保护
32位读密钥保护
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Wafer,COB,
Gold Bump
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TSC9622
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产品说明下载
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ISO/IEC 14443A; ISO/IEC14443B; ISO/IEC 15693
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3.3V,5V
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SO32
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TSC9812
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产品说明下载
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ISO/IEC 14443A; ISO/IEC14443B
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2.5V ,3.6V
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QFN32 , QFN40
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TSC9883
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产品说明下载
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ISO/IEC 14443A; ISO/IEC14443B; ISO/IEC 15693
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3V,5.5V
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QFN32
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